KEI-Cu-ETP

Krishna Engineering Industries


Alloy Name
UNS C-11000
DIN CEN/TS 13388 CW004A
EN E-Cu,E-Cu58
JIS E-Cu,E-Cu58
JIS C-1100

We are producing ETP Grade high Electrical Conductivity Copper Foils, Strips and Sheets with Thickness Range from 0.04mm to 2.5mm & Maximum Width of 400mm in all range of Tempers/ hardness with reduced burr height of below 15 microns.



Cu-ETP Characteristics

Cu-ETP is an oxygen containing copper which has a very high electrical and thermal conductivity. It has excellent forming properties and AMWL-11 Grade is weldable which is very suitable for Foil Wound Transformers.


Chemical Composition Weight percentage
Cu 99.90 min %
O 0.005...0.040 %


Main Applications
Electrical :

Foil Wound Transformers, Switches, Elect. Terminals, Contacts, Flexible Busbars, XLPE Cable Wrap/Shielding Tapes etc.

Industrial :

Stamped/Punched parts, Chlorine Battery Caps, Heat sinks etc.


Physical Properties Typical values in annealed temper at 20 °C
Density 8.93 g/cm3
Thermal expansion coefficient -191 .. 16 14.1 10-6/K
Specific heat capacity - 0 .. 300°C 17.7 10-6/K
Thermal conductivity 0.386 J/(g•K)
Electrical conductivity (1 MS/m = 1 m/(O mm²) 394 W/(m•K)
Electrical conductivity (IACS) 58 MS/m %
Thermal coefficient of electrical resistance (0 .. 200 C) 100 10-3/K
Modulus of elasticity ( 1 GPa = 1 kN/mm²) cold formed 130 GPA

Mechanical Properties (EN 1652)
Temper Tensile Strength Rm MPa
(N/mm2)
Yield Strength Rp0.2 MPa
(N/mm2)
Elongation A50mm % Hardness HV
O (SOFT) 210 min 70 35 Min 65 Max
HB (half Hard) 240 min 180 10 Min 70 to 95
HD (Hard) 290 min 250 90 min

Fabrication Properties
Capacity for being Hot and Cold worked Gas Shield Arc Welding Machinability Excellent Very Good
Capacity for being Hot-Dip Tinned 20% of Free Cutting Brass
KEI usually maintains a surface roughness in range of 0.15 to 0.25 on Ra scale for Better Electroplating Properties. Excellent