ISO 9001 : 2015 ISO 14001:2015 ISO 45001:2018

KEI-Cu-ETP

Krishna Engineering Industries

Alloy Name
UNS C-11000
DIN CEN/TS 13388 CW004A
EN E-Cu,E-Cu58
JIS E-Cu,E-Cu58
JIS C-1100

We are producing ETP Grade high Electrical Conductivity Copper Foils, Strips and Sheets with Thickness Range from 0.04mm to 2.5mm & Maximum Width of 400mm in all range of Tempers/ hardness with reduced burr height of below 15 microns.

Cu-ETP Characteristics

Cu-ETP is an oxygen containing copper which has a very high electrical and thermal conductivity. It has excellent forming properties and AMWL-11 Grade is weldable which is very suitable for Foil Wound Transformers.

Chemical Composition Weight Percentage
Cu 99.90 min %
O 0.005...0.040 %
Main Applications
Electrical:
Foil Wound Transformers, Switches, Elect. Terminals, Contacts, Flexible Busbars, XLPE Cable Wrap/Shielding Tapes etc.
Industrial:
Stamped/Punched parts, Chlorine Battery Caps, Heat sinks etc.
Physical Properties (Annealed at 20°C)
Density 8.93 g/cm³
Thermal expansion coefficient -191 .. 16 14.1 10⁻⁶/K
Specific heat capacity - 0 .. 300°C 17.7 10⁻⁶/K
Thermal conductivity 0.386 J/(g•K)
Electrical conductivity (1 MS/m = 1 m/(O mm²)) 394 W/(m•K)
Electrical conductivity (IACS) 58 MS/m %
Thermal coefficient of electrical resistance (0 .. 200 C) 100 10⁻³/K
Modulus of elasticity (1 GPa = 1 kN/mm²) cold formed 130 GPA
Mechanical Properties (EN 1652)
Temper Tensile Strength Rm MPa Yield Strength Rp0.2 MPa Elongation A50mm % Hardness HV
O (SOFT) 210 min 70 35 Min 65 Max
HB (Half Hard) 240 min 180 10 Min 70 to 95
HD (Hard) 290 min 250 - 90 min
Fabrication Properties
Capacity for being Hot and Cold worked Gas Shield Arc Welding Machinability Excellent Very Good
Capacity for being Hot-Dip Tinned 20% of Free Cutting Brass
KEI usually maintains surface roughness (0.15–0.25 Ra) for better Electroplating Properties. Excellent